India's Semiconductor Mission

2026 was the year India's chip mission moved from announcements to actual assembly-line output. Key milestones:

  • Micron's ATMP facility in Sanand, Gujarat, was inaugurated by PM Modi on February 28, 2026 — the first operational facility of the current mission cycle — followed by Kaynes Semicon's OSAT facility in Sanand on March 31 (₹3,300 crore investment, ~6 million chips/day capacity).
  • Tata Electronics–PSMC's Dholera fab, the flagship 300mm, AI-enabled facility targeting 50,000 wafer starts a month at 28nm–110nm nodes, is aiming for first silicon by late 2026, though full fab commissioning remains targeted for 2028.
  • On May 16, 2026, Tata Electronics and ASML signed an agreement to build India's first front-end fabrication plant in Gujarat.
  • As of mid-2026, 13 semiconductor projects have been approved across seven states under ISM and SPECS, with cumulative investments around ₹1.64 lakh crore.
  • Semicon India 2.0 was approved by the Union Cabinet on July 15, 2026, with an outlay of roughly ₹1,27,500 crore, shifting focus from pure fab creation to equipment, materials, advanced packaging, R&D and talent — alongside a Design Linked Incentive scheme that has now supported 24+ chip design projects.