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India’s First Advanced 3D Glass Chip Packaging Unit (Odisha)
📅 Published 22 Apr 2026 · April 2026
India’s First Advanced 3D Glass Chip Packaging Unit (Odisha)
Ceremony: April 19, 2026, at Info Valley, Khordha, Bhubaneswar.
Developer: 3D Glass Solutions Inc. (USA) via HIPSPL.
Investment: Rs. 1,943.53 crore (Rs. 799 crore central + Rs. 399.5 crore state incentives).
Capacity: 70,000 panels, 50 million units annually.
Timeline: Commercial by August 2028; full-scale by 2030.
Applications: Aerospace, defense, AI, 5G, data centers.
📝 Relevant Exams:
UPSC