Semiconductor OSAT Facility — Madhya Pradesh

MoU

Paras Semiconductors + MPSeDC

Project

Greenfield OSAT facility

OSAT = Outsourced Semiconductor Assembly and Test

Location

Indore–Ujjain region, Madhya Pradesh

Investment

₹6,200 crore

Technology

• 3D heterogeneous integration
• 2.5D/3D packaging
• Hybrid bonding
• Fan-out packaging
• Chiplet integration
• Wafer bumping
• Flip-chip assembly
• Testing
• Reliability validation

Initial Applications

• Sensors
• Optical systems
• Optronic systems
• Strategic applications

Future:
AI chips + advanced semiconductor products

UPSC Angle

GS-III: Semiconductor mission + strategic technology + import substitution + electronics manufacturing.

Prelims:
OSAT = Assembly + Packaging + Testing